In today’s fast-evolving electronics industry, card connectors play a vital role in enabling reliable data and power connections between modules. Whether used in smartphones, IoT devices, automotive electronics, or industrial systems, connector performance directly affects reliability, signal stability, and lifespan.

Dongguan Moarconn Electronic Co., Ltd. is a seasoned manufacturer specializing in SIM, SD, Micro SD, and combo card connectors. With a full in-house production chain—precision stamping → plating → injection molding → assembly → testing → packaging—Moarconn delivers premium quality and consistency to OEM clients worldwide.

This article provides a step-by-step insight into the manufacturing process, giving engineers, buyers, and QA professionals a clear understanding of each stage and the factors that determine connector performance.

2.1 Metal Contacts: Card connector terminals use high-performance copper alloys (phosphor bronze, brass) for elasticity, conductivity, and corrosion resistance. At Moarconn, we ensure stable contact force beyond 5,000+ insertion cycles through precise material selection.

2.2 Plastic Housings: Engineered polymers such as LCP, PA9T, PPS withstand reflow soldering and thermal stress. Moarconn’s molding tolerances of ±0.05 mm guarantee perfect PCB alignment.

2.3 Plating & Surface Finish: After stamping, terminals undergo nickel-gold or nickel-tin plating for conductivity and corrosion protection—key to ensuring long-term reliability.

The first major step in connector manufacturing, high-speed stamping machines feed copper coils through progressive dies to form precision contacts.

Process: coil feeding → precision stamping → deburring → forming and alignment.

Moarconn uses automated inspection to detect burrs and misfeeds early, ensuring stability and consistency.

After stamping, terminals are electroplated with nickel-gold or nickel-tin. Control parameters include bath chemistry, plating thickness, and adhesion strength.

Moarconn’s plating line supports selective plating to reduce cost while maintaining high reliability.

Molten polymer is injected into precision molds, cooled, and ejected.

Critical checkpoints: wall-thickness, voids, dimensional accuracy, and cleanliness.

Moarconn’s multi-cavity tooling and real-time mold monitoring ensure consistent housing precision.

Assembly joins terminals and housings into finished connectors.

Processes may include single or multi-terminal insertion, card-detect spring addition, and grounding shield installation.

Moarconn’s fully automated assembly lines include AOI inspection and mechanical retention force testing.

Each connector undergoes electrical and mechanical tests to verify performance:

Electrical: contact resistance, insulation resistance, continuity.

Mechanical: insertion/withdrawal cycles (1,500–10,000+), retention force, ejection force.

Environmental: thermal cycling, humidity, salt spray.

Moarconn performs 100% functional testing, records SPC data, and supplies detailed reliability reports for OEMs.

Typical challenges include burrs, plating defects, molding voids, and misalignment.

Moarconn implements Design for Manufacturability (DFM) reviews early to reduce defects and enhance process stability.

Full Process Capability: In-house stamping, plating, molding, assembly, testing, packaging.

Customization Expertise: SD, microSD, SIM and combo connectors.

Quality Certified: ISO 9001, RoHS, REACH compliant.

Global Support: Multilingual engineering team and export experience.

From the first copper coil to the final packaged connector, every step defines reliability.

Moarconn’s optimized manufacturing ensures premium-quality card connectors for global customers.

Visit Moarconn.com for free samples and DFM consultation