The thinnest MOARCONN Micro SD socket is H1.15 mm and the thinnest Nano SIM socket is H1.1 mm, with solder-side coplanarity held to 0.05 mm maximum.

Height and coplanarity specifications

Height is measured from the PCB seating plane to the top of the cover. A coplanarity of 0.05 mm max across the full solder area keeps all terminals in reliable contact after reflow, which matters for ultra-thin assemblies where board flex is limited.

• Micro SD sockets from H1.15 mm for slim storage designs
• Nano SIM sockets from H1.1 mm for handsets and wearables
• 0.05 mm max coplanarity across the full solder area