“Signal Integrity & Electrical Requirements for High-Speed SD / SD Express
1. Introduction: Why Signal Integrity Matters in the High-Speed SD / SD Express Era
With SD 7.x / SD 8.0 enabling PCIe / NVMe interfaces and speeds reaching 985 MB/s+, SD technology is entering a true high-speed age.
High performance brings challenges such as:
signal loss
electrical noise
strict impedance requirements
Choosing the right SD Memory Connector is critical to ensuring stability.
MOARCONN provides SD / microSD / SD Express connectors built to SD Association & JEDEC standards, optimized for high-speed signal integrity.
2. Key Electrical Challenges for High-Speed SD / SD Express
1) Signal Loss at High Frequencies
PCIe-based SD Express introduces:
insertion loss
impedance discontinuity
EMI sensitivity
Connector material and terminal geometry become essential.
2) Crosstalk Between Adjacent Terminals
MOARCONN minimizes crosstalk using:
optimized terminal spacing
enhanced shielding
balanced ground terminal layout
3) Contact Resistance Stability
High-speed signals require low and stable contact resistance.
MOARCONN ensures this using:
Japanese phosphor bronze
gold plating (0.8–1.0 μm)
reinforced spring structures
4) Proper Return Path Design
A continuous return path is essential to avoid signal reflection and jitter.
MOARCONN connectors provide:
multiple ground points
optimized PCB pad layout
symmetric terminal arrangement
3. Key Electrical Specs for SD 7.x / SD 8.0 (Simplified)
Based on SD Association Host Implementation Guideline & SD 8.0 Whitepaper.
1) Impedance
PCIe lanes: 85 Ω ±10%
Differential pair matching: ≤ 5 mil
2) Jitter Requirements
SD 8.0 defines:
UI jitter
eye opening
skew tolerance
MOARCONN improves terminal consistency to reduce jitter issues.
3) EMI / EMC Requirements
High-speed SD Express calls for:
stronger shielding
reinforced grounds
better terminal stability
4. How to Choose the Right SD Memory Connector for High-Speed Applications
(1) Material Selection
Phosphor bronze terminals
Gold plating 0.8–1.0 μm
High-temperature insulation (≥ 260°C)
(2) High-Speed Structural Design
Evaluate:
terminal length consistency
optimized pin distribution
sufficient grounding
(3) Impedance Continuity
Check if the vendor provides:
3D models
impedance simulation
S-parameter data
MOARCONN supports SI-driven customization.
(4) Reliability
For SD Express:
≥ 10,000 mating cycles
stable card retention
smooth push-pull mechanisms
5. How MOARCONN Supports High-Speed SD / SD Express Designs
1) SD Express Compatible Connectors
9-pin / 17-pin
top-mount / mid-mount / reverse-mount
EMI-enhanced versions available
2) ODM / OEM Customization
chamfering, push-rod structure
impedance-controlled terminal design
PCB footprint adaptation
3) Manufacturing Quality
automated stamping
gold plating thickness inspection
CCD full inspection
6. Product Recommendation Section
Featured Product: MOARCONN High-Speed SD / SD Express Connector Series
7. Conclusion
Signal integrity and electrical performance are critical for high-speed SD / SD Express systems. The SD Memory Connector you choose determines overall system stability.
With strong engineering capability and SD-standard-compliant designs, MOARCONN provides reliable SD connector solutions for high-speed applications and supports SI-driven customization.
