Five items let us quote without a second round of questions: the PCB footprint with pad dimensions, the mated height your enclosure allows, the card type and interface speed (SD, microSD, UHS-I, UHS-II or SD Express), the operating temperature range, and the annual volume with your assembly method.

If the design is not fixed yet, send the enclosure constraint and the card path instead. Starting from one of our 141 existing models across 13 series is usually faster than opening a new tool, and it keeps the 25-day development cycle available.